UltraSPARC III based systems offer customers investment protection already built in with CPU features including copper interconnect for improved signaling and best-in-class power consumption, shortened 65 nanometer gate length for faster performance, mixed speeds in a chassis, thermal and electrical footprint preservation enabling simple upgrade paths and industry-leading RAS. UltraSPARC III based systems are optimized to meet, or exceed, customer expectations providing real-world performance and reduced Total Cost of Ownership (TCO).